Method for making an article comprising at least a silicon chip

ABSTRACT

The present invention provides a method of manufacturing an article ( 9 ) comprising a fiber layer ( 5 ) and at least one electronic chip ( 7 ), the fiber layer being formed by depositing fibers on a surface ( 3 ) immersed in a dispersion ( 4 ) of fiber material. The method includes the following step:  
     using an elongate flexible support ( 6 ) to bring the electronic ( 5 ) chip into contact with the fiber layer that is being formed.

[0001] The present invention relates to a method of manufacturing anarticle comprising a fiber layer and at least one electronic chip.

[0002] International application WO 99/54842 describes a bank bill madeof paper having a security thread including an electronic chip ofsemiconductive organic polymer. The security thread includes metallizedportions in order to provide direct contact with apparatus for readingdata stored in the chip, in order to power it electrically. Noindication is given about how the bank bill is manufactured.

[0003] German patent application DE 198 33 746 discloses a traveler'scheck obtained by placing a strip of polymer material including anelectronic chip on a first layer of paper and applying a second layer ofpaper thereto so that the polymer strip is sandwiched between the twolayers. Because of the presence of the above-mentioned strip between thetwo layers, the article presents increased thickness all along itslength.

[0004] German patent application DE 196 01 358 discloses a paper articlethat includes a micromodule embedded in its thickness, the micromodulebeing constituted by an integrated circuit and a metal support.

[0005] German patent application DE 196 30 648 discloses a bank billhaving an interrupted security strip and an electronic chip disposedbetween the two portions of the strip.

[0006] The present invention seeks to provide a novel method ofmanufacturing an article presenting increased security, the articlecomprising at least one fiber structure and at least one electronicchip, and in particular an article in which the risk of the electronicchip being removed without damaging the article is reduced and in whichthe electronic chip is difficult to identify.

[0007] The invention thus provides a method of manufacturing an articlecomprising a fiber layer and at least one electronic chip, the fiberlayer being formed by depositing fibers on a surface immersed in adispersion of fiber material, and the method being characterized by thefact that it includes the following step:

[0008] using an elongate flexible support to bring the electronic chipinto contact with the fiber layer that is being formed.

[0009] In the invention, the support and the chip can be bonded to thefiber layer without giving rise to perceptible extra thickness, thusmaking the chip difficult to detect.

[0010] In addition, the chip cannot be removed without damaging thearticle, since it is secured to the support and the support is embeddedin the thickness of the fiber layer, possibly being covered completelyon both faces by the fibers.

[0011] The support is advantageously coated, preferably on both faces,in a heat-sealable varnish which improves its behavior within the fiberlayer.

[0012] The chip may be placed on an outside surface of the support,without being embedded therein.

[0013] The width of the support may lie in the range 1 millimeter (mm)to 50 mm, and in particular in the range 1 mm to 10 mm, for example. Itmay be electrically conductive, except possibly where the chip islocated, being made of metal or otherwise, being metallized orotherwise, and possibly being partially made of metal or metallized.When the chip needs to be connected to an antenna made on the support toenable the chip to operate without contact, the support should benon-conductive, at least in some locations so as to avoidshort-circuiting the antenna or the contacts of the chip. The supportcan thus be non-electrically conductive, at least where the chip islocated.

[0014] In an embodiment, the support is oriented relative to the surfaceon which the fibers are deposited during formation of the fiber layer insuch a manner that the chip is situated on the face of the support thatfaces away from said surface. The fiber layer can then cover the chipand its support completely. The support can be brought into contact withthe fiber layer that is being formed once a certain thickness of fibershas already been deposited on said surface, thereby enabling the supportand the chip to be completely embedded in the fiber layer.

[0015] In a variant, the support is placed in such a manner as to enablethe chip to come into contact with said surface, preferably before it isimmersed. Thus, the chip can be incorporated in the fiber layer whilecoming flush with one face thereof. Such a disposition is advantageous,particularly when the chip is subsequently to be connected to an antennathat is printed or transferred on the fiber layer, as described below,or implemented by other means, such as metallization, demetallization,or photogravure, for example. The above-specified face can then becovered in at least one further layer which may be fibrous ornon-fibrous so that the support and the chip are finally undetectableboth visually and to the touch.

[0016] The above-mentioned immersed surface may be defined by theimmersed portion of a partially immersed paper-making “wire”, inparticular the immersed portion of a rotary wire cylinder in apapermaking machine having a partially immersed cylinder.

[0017] In an implementation, the chip is connected to an antennacomprising at least one turn. The antenna may be carried by the supportused for bringing the chip into the dispersion of papermaking fibers. Inparticular, the antenna may extend around the chip on the support. Theantenna may also be disposed entirely on the chip or it may extend atleast in part over the support.

[0018] The support and the chip need not necessarily have an antenna. Inparticular, the antenna may be made after the fiber layer has beenformed by printing one or more turns on a face of the fiber layer,preferably by silk-screen printing, using a conductive ink.

[0019] In particular, the antenna may be made by means of a methodcomprising the following steps:

[0020] using a conductive ink to make a series of turns on a face of thelayer;

[0021] using an insulating ink to make an insulating bridge over theturns;

[0022] using a conductive ink to make a conductive track on theinsulating bridge and connected to one of the ends of the turns; and

[0023] connecting the chip to the conductive track and to the other endof the turns by means of a conductive resin.

[0024] The antenna may also be made by gravure or by transfer.

[0025] The antenna can act as an induction coil, presenting dimensionsthat are greater than the dimensions of the chip, so as to enabledetection to take place in its proximity or vicinity, having a range of1 centimeter (cm) to 70 cm, approximately, for example.

[0026] As mentioned above, the antenna can also be made directly on thechip, particularly for short-range detection, when a range of 1 mm to 1cm approximately suffices.

[0027] The chips may be based on silicon.

[0028] The chips used may serve solely for reading data, or in avariant, they may be suitable both for reading and for writing data.

[0029] Reading and writing on the chip can be made secure by means of apassword. The transmitted data may be encrypted. The chip may alsocomprise an “anti-collision” system, specifically for use undercircumstances when a plurality of chips are present simultaneously inthe field of a contactless reader apparatus.

[0030] The chips may comprise respective programmable microcontrollers.

[0031] In a particular implementation of the invention, the support, theantenna, or the chip, in particular a varnish or an encapsulation of thechip, may include authentication elements selected so as to avoiddisturbing the operation of the chip. These authentication elements maybe compounds that are magnetic, opaque, or visible in transmission,compounds that emit light under white, ultraviolet or infrared light, inparticular near-infrared, or biomarkers, this list not being exhaustive.

[0032] Advantageously, the thickness of the fiber layer and the natureof the material constituting it are selected in such a manner as toprotect the chip and the antenna from any impacts associated withprocessing the fiber layer to make the article, and associated withusing the article.

[0033] The fiber layer may comprise cellulose fibers and/or artificialor synthetic fibers and/or cotton linters.

[0034] The fiber layer may be a single layer. In a variant, the fiberlayer including the chip may be assembled with a second layer, e.g.another fiber layer, the two layers being bonded by being laminated, forexample.

[0035] A plurality of chips and associated supports may be integrated inthe fiber layer simultaneously, with the layer subsequently being cut upso as to retain only one chip per article.

[0036] The support and the corresponding chip may themselves be cut fromstrips of an insulating film, e.g. made of polyester, having the chipsfixed thereto, preferably at regular intervals, possibly together withthe associated antennas.

[0037] The above-specified strips including the chips may be integratedin a single web of paper while manufacturing said paper, in a cylindermachine, said paper comprising cellulose fibers and possibly artificialor synthetic fibers.

[0038] In an implementation of the invention, an article is madecomprising a fiber layer and at least one electronic chip by a methodcomprising the following steps:

[0039] introducing a chip by means of a flexible support into a firstfiber suspension while making a first web of paper in a papermakingmachine, in particular a machine having at least one cylinder;

[0040] for each chip, providing the web of paper formed in this way withan antenna;

[0041] connecting the antenna to the chip with a conductive resin;

[0042] making a second web of paper by means of a endless wire machineor cylinder machine using a second fiber suspension; and

[0043] laminating the two previously-made webs together, the chips beingsituated on the inside.

[0044] In such an example, the strips carrying the chips do not haveantennas, and they are inserted partway into the thickness of the firstweb of paper so that the chips are directly accessible from one side ofthe web, the remainder of the strip being embedded in the thickness ofthe paper. The antenna can then be applied by printing, transfer, orgravure. The chip does not give rise to any localized extra thicknessand therefore does not modify the outside appearance of the article.

[0045] In an implementation of the invention, an article is madecomprising a fiber layer and at least one electronic chip by a methodcomprising the following steps:

[0046] providing a film having electrically insulating properties atleast in the vicinity of chips and any antennas, provided at preferablyregular intervals with antennas;

[0047] fixing chips on the film by connecting each chip to an antenna,the chips being disposed at preferably regular intervals on the film;

[0048] cutting the film into strips each comprising a line of chips andantennas; and

[0049] inserting the strips into paper made up of two united webs eachcoming, for example, from a cylinder machine, a dual cylinder machine,or a cylinder and endless wire machine, etc.

[0050] Advantageously, the film is coated in a heat-sealable varnish onboth faces so as to improve the behavior of the strip in the layer.

[0051] The strip carrying the chips may be introduced into the thicknessof the first web so that the chips are flush with one side of the web,the remainder of the strip being embedded in the thickness of the paper.The second web then covers the first web on the same side as the chips.The resulting article does not present any localized extra thickness.

[0052] The invention also provides an article obtained by implementingthe above-defined method.

[0053] Such an article can constitute a cardboard pack, for example.

[0054] The article can also be self-adhesive, in particular constitutinga sticky label. Such a label can comprise a fiber layer including thechip and covered in adhesive on one face.

[0055] The invention also provides an article comprising a fiber layercoming from a single web of paper, the strip that is not electricallyconductive in the vicinity of the chip extending continuously betweentwo ends of the article, a chip provided with an optionally integratedantenna being fixed on said strip, said strip being entirely covered bythe fibers of the fiber layer as is the chip, the article not presentingany perceptible extra thickness over the chip or the strip.

[0056] The invention also provides an article comprising at least twolayers, including a fiber layer receiving in its thickness a strip and achip stuck thereto, an antenna electrically connected to the chip, saidantenna being situated at the interface between the two layers, saidstrip being completely covered by the fibers of the fiber layer. Thestrip also extends continuously between two edges of the article and thearticle does not present any perceptible extra thickness in the vicinityof the strip or the chip. The chip comes flush with the face of thefiber layer that comes into contact with the other layer.

[0057] Independently of the above-mentioned aspects, the invention alsoprovides an article comprising:

[0058] at least one fiber layer;

[0059] an electronic chip in the fiber layer, said chip comprising anintegrated first antenna; and

[0060] a second antenna coupled in inductive manner to said integratedfirst antenna, without physical electrical contact between the first andsecond antennas.

[0061] The second antenna may constitute an authentication element, andin particular it may be optically variable.

[0062] The second antenna may comprise a film which has beendemetallized in such a manner as to create the turns of the antenna. Thefilm may be a holographic film. The second antenna may also be ahologram other than a demetallized hologram.

[0063] The electronic chip may be fixed on a support of elongate shape,in particular a strip, which may be completely covered by the fiberlayer.

[0064] The support may extend from a first edge of the article to asecond edge, opposite from the first.

[0065] Other characteristics and advantages of the present inventionappear on reading the following detailed description of non-limitingimplementations, and on examining the accompanying drawings, in which:

[0066]FIG. 1 is a diagram showing a step of the method of manufacturinga fiber layer in a first implementation of the invention;

[0067]FIG. 2 is a diagrammatic and fragmentary view in cross-section ofthe resulting fiber layer;

[0068]FIG. 3 is a diagrammatic and fragmentary view of a cardboard packincluding a chip;

[0069]FIG. 4 is a diagram showing a step in the method of manufacturinga fiber layer in a second implementation of the invention;

[0070]FIG. 5 is a diagram showing a fragmentary cross-section of theresulting fiber layer;

[0071]FIG. 6 is a diagram showing a fragmentary cross-section of anarticle comprising two fiber layers;

[0072]FIG. 7 is a fragmentary perspective diagram of a fiber layerhaving an antenna formed thereon which is connected to the chip;

[0073]FIG. 8 is a diagram showing two fiber layers being laminatedtogether;

[0074]FIG. 9 is a diagram showing another method of making andassembling two fiber layers;

[0075]FIG. 10 is a diagram showing a portion of an adhesive label inaccordance with the invention;

[0076]FIG. 11 is a diagrammatic fragmentary view of an articleconstituting a variant embodiment of the invention; and

[0077]FIG. 12 is a diagrammatic fragmentary view of an articleconstituting another variant embodiment of the invention.

[0078] For reasons of clarity, the relative proportions between thevarious elements shown in the drawings are not always complied with, theviews being diagrammatic.

[0079]FIG. 1 is a fragmentary and diagrammatic view of a cylindermachine for making paper. The machine comprises a vessel 1 containing asuspension 4 of fibers, for example cellulose fibers and/or cottonlinters and/or synthetic and/or artificial fibers, with a rotary wirecylinder 2 being partially immersed therein to define a surface 3 havinga fiber layer 5 being formed continuously in contact therewith.

[0080] While it is being formed, an elongate support is incorporated inthe fiber layer 5. The support is constituted by a strip 6 carrying onone face 6 a a plurality of electronic chips 7 disposed at regularintervals. The strip 6 is also referred to as a “thread” since its widthis relatively narrow, for example lying in the range 1 mm to 50 mm. Inthe present application, the terms “thread” and “strip” should beconsidered as being synonyms.

[0081] The chips 7 are of passive type, enabling data to be transmittedwithout contact, each chip being connected to an antenna comprising atleast one turn, and preferably a plurality of turns.

[0082] The chips 7 are based on silicon, for example, and they can beabout 200 micrometers (μm) thick. The thickness of the chips should beselected as a function of the thickness of the fiber layer.

[0083] The antennas can be of dimensions greater than the dimensions ofthe chips, thus making detection possible in the immediate proximity orthe vicinity thereof, for example detection at a range of at least 1 cmand possibly up to 70 cm. In a variant, when short distance detectionsuffices, i.e. at a range of at least 1 mm but not more than about 1 cm,the antenna can be made directly on the same substrate as the chip.

[0084] Thus, in the example of FIGS. 1 and 2, each of the chips 7 has anantenna integrated therein. These can be chips sold under the nameIC-Link® by thee supplier Inside Technologies, presenting together withthe corresponding antenna dimensions of about 2.2 mm by 2.3 mm and athickness of about 250 μm. These chips operate in read and write modesat a frequency of 13.56 MHz and they can be detected at a distance of upto 5 mm.

[0085] The strip 6 is obtained as follows.

[0086] To begin with, an epoxy, a cyanoacrylate, or an isocyanateadhesive is used to fix a plurality of chips 7 on a polyester film, e.g.a film that is about 12 μm thick. Thereafter a heat-sealable varnish isoptionally deposited thereon to reinforce adhesion in the fiber layer,the varnish used possibly including fluorescent or magnetic securitycompounds. The varnish is raised to a temperature which is sufficientlyhigh during manufacture of the structure by means of heat from therollers with which the fiber layer comes into contact, for example. Thenthe film is cut into strips each having a width of about 3 mm, the chips7 being placed on a surface of the film so as to be spaced apart at 20cm from one another along the length of each strip 6. The resultingstrips 6 are wound on reels while waiting to be integrated in the paper.

[0087] Each strip 6 is incorporated in the fiber layer 5 by beingbrought into contact with fibers that have just become deposited on theimmersed surface 3 of the cylinder 2, as shown in FIG. 1.

[0088] The side 6 b of the strip 6 that does not carry chips 7 facestowards the surface 3 of the wire so that the fiber material covers thestrip completely including its chips 7 when the web of paper leaves thecylinder machine together with the strip 6 and the chips 7.

[0089]FIG. 2 shows that the strip 6 and the chips 7 are completelyembedded within the thickness of the fiber layer 5 so that the chip 7 isnot detectable visually or to the touch and does not give rise to anyextra thickness.

[0090] The fiber layer 5 may present a final thickness of about 400 μmand constitute paper board, for example.

[0091] After drying, the fiber layer 5 can be cut so as to form acardboard pack 9, for example as shown in FIG. 3.

[0092] It can be seen that the strip 6 extends continuously between twoopposite edges 10 and 11 of the pack 9. Thus, the strip 6 or the chip 7cannot be removed without damaging the pack 9, given that the force ofadhesion between the chip 7 and the strip 6 is very strong.

[0093] It would not go beyond the ambit of the present invention for thechip 7 not to be in direct contact with an antenna configured to enablethe detection range to be increased, for example.

[0094] By way of example, it is possible to use a chip which isconfigured to be capable of coupling with an antenna 15 inductively.

[0095] The chip is preferably centered relative to the antenna 15, asshown in FIG. 11.

[0096] Since the antenna 15 does not make direct contact with the chip,it can be made, for example, on the face 5 b of the fiber layer 5 whichis situated beside the support 6 or on another web.

[0097] The dimensions of the antenna 15 can be significantly larger thanthe dimensions of the chip, thereby enabling detection to be performedat a relatively great distance.

[0098] The chip and antenna assembly as obtained in this way can alsopresent good ability to withstand external stresses because of theabsence of any physical connection between the chip and the antenna.

[0099] In the example described, it is possible to use an IC-Link® chipas mentioned above, which chip includes an integrated antenna. Saidantenna is coupled in inductive manner to an antenna 15.

[0100] Another fiber layer 17 may optionally be assembled with the fiberlayer 5, as shown in FIG. 11.

[0101] In another implementation of the invention, chips 7 that areinitially not provided with antennas are stuck onto a film, e.g. apolyester film. The chips 7 can be constituted, for example, by thosesold under the name I CODE by the supplier Philips, which chips operatein read and write modes at a frequency of 13.56 MHz and can be detectedat a distance of up to 1.5 meters (m) depending on the antenna used.

[0102] The film is then cut up into strips 6 that are 2 mm wide, withthe chips 7 being spaced apart on each strip at 20-cm intervals.

[0103] As shown in FIG. 4, each strip 6 is brought into the cylindermachine under controlled tension so that the chips 7 come into contactwith the surface 3 of the wire prior to the fiber material becomingdeposited thereon. As a result, the chips 7 are flush in one of thefaces 5 a of the fiber layer 5, as can be seen in FIG. 5, while thethread 6 is itself embedded.

[0104] Thereafter, an antenna 15 can be made for each chip 7 as follows.

[0105] A conductive ink, e.g. a silver-based ink, is silkscreen printedon the face 5 a of the fiber layer 5 to form a series of turns. Theconductive ink may also include authentication elements selected so asto avoid disturbing the operation of the chip, for example compoundsthat are fluorescent, being suitable for being excited by ultraviolet orinfrared radiation, or else being constituted by biomarkers. The printedturns have two ends 15 a and 15 b, with the first end 15 a being closeto the chip 7, as can be seen in FIG. 7.

[0106] Thereafter, an insulating ink is used to print an insulatingbridge passing over the turns between the two ends 15 a and 15 b, and aconductive ink is used to form a conductive track 16 on the bridge, saidtrack being electrically connected via one end 16 b to the end 15 b ofthe turns. The other end 16 a of the track 16 and the end 15 a of theturns are connected to the chip 7 by means of conductive ink.

[0107] The antenna 15 of the FIG. 11 embodiment can also be made using aconductive ink.

[0108] In a variant, the antenna 15 described with reference to FIG. 7or 11 can be made by transfer or by gravure.

[0109] The antenna 15 can also be put into place on the fiber materialin some other way.

[0110] The antenna 15 can be obtained, for example, by transferring ahologram comprising a metal layer that has been locally demetallized, soas to form conductive tracks, as shown in FIG. 12.

[0111] The antenna can be present on the outside face 5 a.

[0112] Thus, the antenna 15 can also constitute a security element as aresult of the properties of optical variability presented by thehologram.

[0113] The antenna 15 can also be made by transferring a metal pattern,e.g. a copper pattern.

[0114] The antenna 15 can also be made by electrolytically depositing ametal, for example, on a support previously printed with a conductiveink forming the pattern of the antenna. The support is then assembledwith the fiber layer carrying the chip, e.g. by being laminatedtherewith.

[0115] With reference again to the FIG. 7 embodiment, once the antenna15 has been connected to the chip 7, the fiber layer 5 is assembled to asecond layer 17, e.g. a fiber layer presenting a thickness of about 100μm and covering the face 5 a.

[0116] The two fiber layers 5 and 17 can be assembled together, forexample, by lamination using adhesive deposited by a roller 23 betweentwo cylinders 20 and 21 of a laminating machine, as shown in FIG. 8,with the resulting paper presenting a total thickness of 400 μm andbeing suitable for cutting out to form a pack such as the pack shown inFIG. 3.

[0117] As in the preceding example, the resulting pack does not presentany perceptible extra thickness in the zone containing the strip 6 andthe chip 7, so they remain undetectable visually or to the touch.

[0118] In another implementation of the invention, the support 6 isconstituted by a polyester strip that is 90 μm thick and 4 cm wide. Thechips 7 which are fixed to said strip 6 can be identical to those of thepreceding example, for example. The antennas can be printed ortransferred onto the support, and each electrically connected to a chip.The antennas can also be made by metallization, demetallization, orphotogravure.

[0119] In this example, a two-cylinder machine is used to form a firstfiber layer 30 in which the strip 6 is incorporated in such a mannerthat the chips 7 are flush with one of the faces of the fiber layer, byproceeding as described with reference to FIG. 4.

[0120] The thickness of the first web of paper is about 400 μm, forexample.

[0121] A second web of paper 31 is made in parallel, having a thicknessof 100 μm, for example, and the two webs 30 and 31 are assembledtogether while in the wet state by passing between the wire cylinderused for making the second web 31 and a roller 33, the second web 31covering the chips 7, as shown in FIG. 9.

[0122] The resulting card is dried on the papermaking machine at atemperature of about 100° C. and presents a thickness of 500 μm. As inthe preceding examples, the chips 7 are not detectable either visuallyor to the touch.

[0123] In another implementation of the invention, after the step ofincorporating chips in the fiber layer 5, as shown in FIG. 4, and afterthe step of making antennas by silkscreen printing, instead ofassembling the fiber layer 5 with a second fiber layer 17, said fiberlayer 5 is dried and then assembled with a silicone-covered protectivefilm 25 that is covered oh its face turned towards the fiber layer 5 ina pressure-sensitive adhesive. The protective film 25 is intended to beremoved at the moment of use.

[0124] The fiber layer 5 covered in the protective film 25 can be cut soas to form adhesive labels, such as the label shown in FIG. 10, eachlabel having a chip 7.

[0125] The chip can be used as a security element in a passport, forexample.

[0126] Thus, in an implementation of the invention, a 50-μm thickFlexchip® chip is stuck onto a 13-μm thick strip, with the silicon ofthe chip being planed down in order to reduce its thickness.

[0127] The strip is incorporated in a fiber layer as in the precedingimplementation, and is then connected to an antenna and laminated withadhesive to the paper covering a passport.

[0128] The invention makes it possible to provide effectiveauthentication means, since any attempt at removing the chip willinevitably result in the article being visibly damaged.

[0129] Furthermore, the fiber layer in which the chip is integratedcontributes to protecting it against impacts.

[0130] Naturally, the invention is not limited to the implementationsdescribed above.

[0131] The fiber layer can receive the treatments that are usual inpapermaking and can include conventional elements for preventingfalsification and for providing security.

[0132] The chip may perform functions of authentication and/or oftraceability.

[0133] The chip may also provide protection against theft when itsfrequency corresponds to the frequency of detection gates.

1/ A method of manufacturing an article (9) comprising a fiber layer (5)and at least one electronic chip (7), the fiber layer being formed bydepositing fibers on a surface (3) immersed in a dispersion (4) of fibermaterial, and the method being characterized by the fact that itincludes the following step: using an elongate flexible support (6) tobring the electronic (5) chip into contact with the fiber layer that isbeing formed. 2/ A method according to claim 1, characterized by thefact that the support and the chip are integrated in the fiber layerwithout giving rise to perceptible extra thickness. 3/ A methodaccording to either preceding claim, characterized by the fact that thesupport (6) does not conduct electricity, at least in the location ofthe chip. 4/ A method according to any preceding claim, characterized bythe fact that the width of the support (6) lies in the range 1 mm to 50mm, and in particular in the range 1 mm to 10 mm. 5/ A method accordingto any preceding claim, characterized by the fact that the support (6)is covered completely by fibers of said fiber layer (5). 6/ A methodaccording to any preceding claim, characterized by the fact that thesupport is preferably coated on both faces in a heat-sealable varnish.7/ A method according to any preceding claim, characterized by the factthat the support (6) is oriented relative to the surface (3) on whichthe fibers are deposited during formation of the fiber layer in such amanner that the chip is situated on the face (6 a) of the support thatfaces away from said surface. 8/ A method according to any one of claims1 to 6, characterized by the fact that the support is placed in such amanner that the chip can come into contact with said surface (3),preferably prior to being immersed. 9/ A method according to claim 8,characterized by the fact that the chip (7) lies flush with one of thefaces (5 a) of said fiber layer (5). 10/ A method according to thepreceding claim, characterized by the fact that said face (5 a) iscovered by another optionally fibrous layer (17) so that the support (6)and the chip (7) are undetectable visually and to the touch. 11/ Amethod according to any preceding claim, characterized by the fact thatsaid surface (3) is defined by the immersed portion of a partiallyimmersed rotary wire cylinder of a cylinder machine. 12/ A methodaccording to any preceding claim, characterized by the fact that aplurality of chips (7) are fixed on the support (6), in particular byadhesive. 13/ A method according to any preceding claim, characterizedby the fact that the support is made by cutting up into strips (6) afilm on which chips (7) have been stuck, the chips being distributed onthe film in such a manner as to be regularly spaced apart on saidstrips. 14/ A method according to any preceding claim, characterized bythe fact that the chip (7) is connected to an antenna (15) comprising atleast one turn. 15/ A method according to the preceding claim,characterized by the fact that the antenna is carried by the support (6)used for bringing the chip into the dispersion of papermaking fibers.16/ A method according to the preceding claim, characterized by the factthat the antenna extends around the chip on the support. 17/ A methodaccording to any one of claims 1 to 13, characterized by the fact thatthe antenna is disposed on the chip itself. 18/ A method according toany one of claims 1 to 13, characterized by the fact that the support(6) and the chip (7) do not have any antenna. 19/ A method according tothe preceding claim, characterized by the fact that the antenna is madeon the fiber layer (5) after said layer has been formed. 20/ A methodaccording to claim 19, characterized by the fact that the antenna ismade by means of a method comprising the following steps: using aconductive ink to make a series of turns on one face of the fiber layer;using an insulating ink to make an insulating bridge over the turns;using a conducive ink to make a conductive track (16) on the bridge, thetrack being connected to one of the ends (15 b) of the turns; and usinga conductive resin to connect the chip to the conductive track and tothe other end (15 a) of the turns. 21/ A method according to anypreceding claim, characterized by the fact that the chip is based onsilicon. 22/ A method according to any preceding claim, characterized bythe fact that the chip enables data to be transmitted without contact.23/ A method according to any preceding claim, characterized by the factthat the support (6) is made of polyester. 24/ A method according to anyone of claims 1 to 23, characterized by the fact that the fiber layer(5) is the only fiber layer. 25/ A method according to any one of claims1 to 23, characterized by the fact that the article comprises at leasttwo superposed fiber layers, assembled together by lamination, one ofthe layers including the chip. 26/ A method according to claim 1,characterized by the fact that it comprises the following steps: using aflexible support to introduce a chip into a first suspension of fiberswhile making a first web of paper in a papermaking machine, thechip-carrying strips having no antennas and being introduced partwaythrough the thickness of the first web of paper so that the chips aredirectly accessible on one side of the web, the remainder of the chipbeing embedded in the thickness of the paper; providing the resultingweb of paper with an antenna for each chip; using a conductive resin toconnect the antenna to the chip; using a second suspension of fibers tomake a second web of paper by means of an endless wire machine or acylinder machine; and laminating the two previously-made webs togetherwith the chips situated on the inside. 27/ A method according to claim1, characterized by the fact that it comprises the following steps:providing a film having electrically insulating properties at least inthe locations of chips and any antennas, the film being provided atpreferably regular intervals with antennas; fixing chips on the film,connecting each chip to an antenna, the chips being disposed atpreferably regular intervals on the film; cutting the film into stripseach comprising a line of chips and antennas; and introducing the stripsinto paper formed by uniting two webs, the strip carrying the chipsbeing introduced into the thickness of the first web so that the chipsare flush with one side of said web, the remainder of the strip beingembedded in the thickness of the paper, the second web covering thefirst web beside the chips. 28/ A method according to the precedingclaim, characterized by the fact that the film is coated in aheat-sealable varnish on both faces. 29/ A method according to anypreceding claim, characterized by the fact that at least one of thesupport, the chip, in particular a varnish or an encapsulation of saidchip, or a possible antenna, includes at least one authenticationelement. 30/ A method according to the preceding claim, characterized bythe fact that the authentication element is selected from amongstcompounds that are magnetic, opaque, or visible in transmission,compounds that emit light under white, ultraviolet or infrared light, inparticular near-infrared, in particular biomarkers. 31/ An articleobtained by implementing the method according to any preceding claim.32/ An article according to claim 31, characterized by the fact that itconstitutes a cardboard pack. 33/ An article characterized by the factthat it comprises a fiber layer coming from a single web of paper, astrip that is not electrically conductive at least in the locations ofchips extending continuously between two ends of the article, a chipbeing fixed on said strip, the strip being completely covered by thefibers of the fiber layer as is the chip, the article not presenting anyperceptible extra thickness over the chip over the strip. 34/ An articlecharacterized by the fact that it comprises at least two layers,including a fiber layer housing a strip and a chip stuck thereto in itsthickness, an antenna electrically connected to the chip, said antennabeing situated at the interface between the two layers, said strip beingcompletely covered by the fibers of the fiber layer, the strip extendingcontinuously between two edges of the article and the article notpresenting any perceptible extra thickness over the strip or the chip,said chip coming flush with the face of the fiber layer that is incontact with the other layer. 35/ An article comprising: at least onefiber layer; an electronic chip (7) in the fiber layer, said chipcomprising an integrated first antenna; and a second antenna (15)coupled in inductive manner to said integrated first antenna, withoutphysical electrical contact between the first and second antennas. 36/An article according to claim 35, characterized by the fact that thesecond antenna constitutes an authentication element, being inparticular optically variable. 37/ An article according to claim 35 orclaim 36, characterized by the fact that the second antenna comprises afilm which is demetallized in such a manner as to create the turns ofthe antenna. 38/ An article according to claim 37, characterized by thefact that the film is a holographic film. 39/ An article according toany one of claims 38 to 38, characterized by the fact that the chip isfixed on a support of elongate shape, in particular a strip (6). 40/ Anarticle according to claim 39, characterized by the fact that thesupport is completely covered by the fiber layer. 41/ An articleaccording to claim 39 or claim 40, characterized by the fact that thesupport (6) extends from a first edge of the article to a second edge,opposite from the first.